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SEMI E40-1106 (technical revision)
This Test Method is therefore destructive to the silicon wafer
This Test Method should only be used for comparing the thermal characteristics of plastic packages in the same fluid bath system due to the thermophysical properties of the heat transfer fluids used and the effects of the variable nature of the fluid-stirring and package-mounting procedures
SEMI MF1388-1106 (technical revision)
SEMI G87-1108 (Reapproved 0215)
MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices StdPbc-0119 SEMI E40-1106 (technical revision)1 Purpose 1. 1 Although the substrates used in the production of MEMS share many physical and electrical properties with those used in IC manufacturing there are some significant differences as well. There exists a need to standardize MEMS substrates to allow the stocking of standard material, lowering the time to purchase, time to market and overall cost. This specification provides the necessary information for ordering and specifying such