G02500 - SEMI G25 - Test Method for Measuring the Resistance of Package Leads Revision:SEMI G25-89 (Reapproved 0811) - Inactive This Test Method is intended

This Test Method is intended to help differentiate between MFC designs on the basis of relative resistance to corrosion-induced failure

SEMI E4-86 (technical revision)

SEMI D50-0316 (technical revision)

and patterned wafers

If specific inlet challenge(s) and/or inlet measurements are required

G02500 - SEMI G25 - Test Method for Measuring the Resistance of Package Leads Revision:SEMI G25-89 (Reapproved 0811) - Inactive This Test Method is intendedThis Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www. semiviews. org and www. semi. org in August 2011; originally published in 1984; previously published in 1989. This Document defines the equipment, materials, and procedure used to measure the resistance of leads in packaging elements.