E12900 - SEMI E129 - Guide to Assess and Control Electrostatic Charge in a Semiconductor Manufacturing Facility Lang-English 1 This Guide provides the

1  This Guide provides the tools to describe individual wafers in a 3DS-IC process

Reduce the attraction of particles to charged surfaces

The VLSI grade purity level is typically required by semiconductor devices with geometries of 0

この文書の目的は：(1) 20/0

It provides the functionality required for process management for modules within a cluster tool

E12900 - SEMI E129 - Guide to Assess and Control Electrostatic Charge in a Semiconductor Manufacturing Facility Lang-English 1 This Guide provides theThe purpose of this Guide is to minimize the negative impact on productivity caused by static charge and electric fields in semiconductor manufacturing environments. It is a guide for establishing electrostatic compatibility in facilities used for semiconductor manufacturing. Electrostatic compatibility of production equipment is addressed in SEMI E78. Electrostatic surface charge causes a number of undesirable effects in semiconductor manufacturing