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and automated test equipment
SEMI M62-1105 (first published - replaces SEMI M2 and SEMI M11)
SEMI E37-0303 (designation update)
This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and their interchangeability at all mechanical interfaces
• Cleanroom Paper
G10000 - SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G100-1122 - Current and automated test equipmentMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics to use for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these materials require the different characteristics and performances. The characteristics
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