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本ドキュメントの目的は，(1) 10/0
It assumes the existence of terminology described in other SEMI Flat Panel Display Documents
1 This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure processed wafers to be used in a 3DS-IC process
This Guide addresses universal alignment mark
This specification is specific to Hydrogen (H2)
3D00300 - SEMI 3D3 - Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames StdTpc-Chemical & Gas General Specifications 本ドキュメントの目的は，(1) 10/0This Guide provides the user with information about containers needed to ship thin wafers that are mounted on dicing tape to tape frames conforming to either SEMI G74 or SEMI G87. This Guide covers the shipping of 300 mm nominally diameter silicon wafers. The actual diameter of a 300 mm (nominal) silicon wafer may be less than 300 mm due to material removal via edge trim; the diameter of 300 mm silicon wafers fabricated specifically for use as carrier
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