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SEMI C40-1110 (Reapproved 0618)
The purpose of this Document is to define the basic interface dimensions of a load port on the semiconductor manufacturing equipment (SME)
- There is not a fixed minimum diameter for nominal 300 mm wafers
which is used in the semiconductor industry for the deposition of aluminium metal by vapor deposition techniques and aluminium oxide based layers by atomic layer deposition
total failure rate (TFR)
E13200 - SEMI E132 - Specification for Equipment Client Authentication and Authorization Revision:SEMI E132-0310 - Superseded SEMI C40-1110 (Reapproved 0618)* This Standard has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the redline document and the Current document, the Current version is the official and authoritative version. 1